Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding

A drastically growing requirement of electronic packages with an increasing level of complexity poses newer challenges for the competitive manufacturing industry.Coupled with harsher operating conditions, these challenges affirm the need for encapsulated board-level (2nd level) packages.To reduce thermo-mechanical loads induced on the electronic co

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Forced finite-time barotropic instability

The finite-time barotropic instability problem is modified by investigating the impact of an anomalous (steady) forcing on the development of optimal initial perturbations.Although the model considered is linear, due to the nonlinear optimization procedure the addition of a forcing can influence the initial disturbance.In particular, a quasi-geostr

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